US Patent Issued to FUJIFILM on June 30 for "Ultrasound probe with heat transfer structure" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,335, issued on June 30, was assigned to FUJIFILM Corp. (Tokyo).

"Ultrasound probe with heat transfer structure" was invented by Takayuki Iwashita (Chiba, Japan), Hiroshi Hattori (Chiba, Japan), Tomohiro Shiraishi (Chiba, Japan), Hidetsugu Katsura (Chiba, Japan), Wataru Sawada (Chiba, Japan) and Sachio Shimada (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Behind an electronic circuit, a main backing is provided. The main backing has two outer surfaces (high thermal conductivity surfaces) perpendicular to a Y direction, and two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. The two outer surfaces per...