US Patent Issued to FUJIFILM on Feb. 17 for "Conductive substrate comprising a conductive thin wire containing a metal and method of making thereof" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,194, issued on Feb. 17, was assigned to FUJIFILM Corp. (Tokyo).

"Conductive substrate comprising a conductive thin wire containing a metal and method of making thereof" was invented by Aya Nakayama (Kanagawa, Japan), Katsuyuki Nukui (Kanagawa, Japan), Yuya Motomura (Kanagawa, Japan), Toru Ogawa (Kanagawa, Japan) and Shinichi Nakahira (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for a conductive substrate, with which a conductive substrate including a substrate and a conductive thin wire arranged on the substrate are manufactured, includes in the following order, a step 1 of forming a thin wire containing a m...