US Patent Issued to FUJIFILM Electronic Materials U.S.A. on March 31 for "Chemical mechanical polishing compositions and methods of use thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,224, issued on March 31, was assigned to FUJIFILM Electronic Materials U.S.A. Inc. (North Kingstown, R.I.).

"Chemical mechanical polishing compositions and methods of use thereof" was invented by Yannan Liang (Gilbert, Ariz.), Bin Hu (Chandler, Ariz.), Ting-Kai Huang (Tainan, Taiwan), Shu-Wei Chang (Taoyuan District, Taiwan) and Liqing (Richard) Wen (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one az...