US Patent Issued to FUJIFILM Business Innovation on Jan. 20 for "Packaging material and packing material" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,620, issued on Jan. 20, was assigned to FUJIFILM Business Innovation Corp. (Tokyo).

"Packaging material and packing material" was invented by Keigo Yamada (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging material includes a first surface part that is adjacent to one side of a boundary line and has a bottom plate on which an object to be packaged is placed, and a second surface part that is adjacent to the other side of the boundary line and has a top plate that holds and wraps the object to be packaged with the bottom plate in a state of being folded along the boundary line, the boundary line being interposed between the f...