US Patent Issued to Fujian Jinhua Integrated Circuit on March 31 for "Semiconductor structure and method for forming the same" (Taiwanese, Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,437, issued on March 31, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China).

"Semiconductor structure and method for forming the same" was invented by Yi-Wang Jhan (Taichung City, Taiwan), Fu-Che Lee (Taichung City, Taiwan), Gang-Yi Lin (Taitung County, Taiwan), An-Chi Liu (Tainan City, Taiwan), Yifei Yan (Jinjiang City, China) and Yu-Cheng Tung (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a contact structure disposed on the substrate, and two first gate structures disposed on the substrate and at two sides of the first contact structure. The con...