US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Test jig, testing method, and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,413, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Test jig, testing method, and method of manufacturing semiconductor device" was invented by Mitsuru Yoshida (Shiojiri-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test jig for testing a plurality of semiconductor devices formed on a wafer, including: a substrate having an opening extending therethrough in an up-down direction, to allow air to be injected from the opening during testing; a chamber formed to surround the opening, and being positioned lower than the substrate; and a first probe for measuring each semiconductor device, the first probe being ...