US Patent Issued to FUJI ELECTRIC on Nov. 25 for "Semiconductor device manufacturing method and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,727, issued on Nov. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device manufacturing method and semiconductor device" was invented by Yoshiaki Takahashi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method includes preparing a semiconductor chip and a conductive plate having a front surface that includes a disposition area on which the semiconductor chip is to be disposed, forming a supporting portion in a periphery of the disposition area of the conductive plate such that the supporting portion protrudes from a bottom of the disposition area in an upward direction...