ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,950, issued on March 17, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor cooling apparatus with uniform flow distribution structures" was invented by Takahiro Koyama (Matsumoto-city, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is...