US Patent Issued to FUJI ELECTRIC on June 9 for "Semiconductor module, semiconductor device, and vehicle" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,042, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module, semiconductor device, and vehicle" was invented by Mai Saito (Kawasaki, Japan) and Yoko Nakamura (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a stacked substrate; a semiconductor element arranged on an upper surface of the first circuit board; a metal wiring board including a first bonding portion bonded to an upper surface of the semiconductor element with a bonding material; and a sealing resin that seals the stacked substrate, the semiconductor element, and the metal wiring board. The first bon...