US Patent Issued to FUJI ELECTRIC on June 9 for "Semiconductor device having wire protecting part" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,040, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device having wire protecting part" was invented by Rikihiro Maruyama (Matsumoto-city, Japan), Yoshinori Oda (Matsumoto-city, Japan) and Takahito Harada (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire protecting part partially encloses a first lead frame and a second lead frame and has an enclosing surface from which the first and second lead frames protrude. The enclosing surface is parallel to semiconductor chips, and includes a water stop part protruding, from the enclosing surface, between the first and second lead frames."...