US Patent Issued to FUJI ELECTRIC on June 16 for "Method of manufacturing semiconductor device and jig set" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,263, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Method of manufacturing semiconductor device and jig set" was invented by Koichiro Iyama (Matsumoto City, Japan), Takashi Akahane (Matsumoto City, Japan) and Yoshiaki Takahashi (Matsumoto City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A jig set for placing an insulated circuit board on a cooling surface of a cooling unit, and a method for placing the insulated circuit board on the cooling surface using the jet set. The jig set includes: a positioning jig configured to be disposed on the cooling surface, and having an opening corresponding to a size of the ...