US Patent Issued to FUJI ELECTRIC on July 28 for "Method for manufacturing semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,809, issued on July 28, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Method for manufacturing semiconductor module" was invented by Tatsuo Nishizawa (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor module can prevent performance and reliability degradation of a semiconductor module. The method for manufacturing a semiconductor module includes: arranging an insulating wiring board on a low die; arranging a sintering material at plural locations on the insulating wiring board and arranging a semiconductor chip on each of the plural sintering materials; arranging a structure ...