US Patent Issued to FUJI ELECTRIC on Jan. 27 for "Semiconductor device with sealing surfaces of different height and semiconductor device manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,834, issued on Jan. 27, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device with sealing surfaces of different height and semiconductor device manufacturing method" was invented by Takafumi Yamada (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device, including a cooling body, a semiconductor unit including a wiring portion electrically connected to a semiconductor chip, and a sealing member sealing the entire semiconductor unit over a cooling surface of the cooling body. The sealing member includes a first portion and a second portion which surrounds the first portion in a plan view. The fi...