ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,650, issued on Feb. 17, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor module" was invented by Tadahiko Sato (Kawasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a laminate substrate including an insulating plate and first and second circuit boards on an upper surface of the insulating plate, the first semiconductor device on an upper surface of the first circuit board, a first main terminal, and a first metal wiring board that electrically connects the first semiconductor device to the first main terminal. The first metal wiring board has a first bonding section bonded to an upper...