ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,103, issued on Dec. 2, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan).
"Semiconductor module" was invented by Masayoshi Nakazawa (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module including: a plurality of first semiconductor chips; a resin case provided surrounding an accommodation space for accommodating the plurality of first semiconductor chips; a first gate terminal connected to a gate pad of the plurality of first semiconductor chips; a plurality of first main gate wirings provided in the accommodation space, each of which is connected to the gate pad of the plurality of first semiconductor chips; ...