ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,054, issued on Aug. 4, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor device" was invented by Yuko Nakamata (Matsumoto-city, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is extremely reliable because a sealant thereof is difficult to deteriorate even when a SiC semiconductor element is energized. The semiconductor device is produced by sealing a SiC semiconductor element 11 mounted on a multilayer substrate 12 and electrically conductive connection members 14 and 18 with a sealant 20 containing an ultraviolet light absorbent."
The patent was filed on May 25, 2022, under Application No. 17/824,...