US Patent Issued to FUJI ELECTRIC on Aug. 18 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,941, issued on Aug. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module" was invented by Katsunori Suzuki (Matsumoto-city, Japan), Keishirou Kumada (Matsumoto-city, Japan), Yuichiro Hinata (Matsumoto-city, Japan), Ryoichi Kato (Matsumoto-city, Japan), Masahide Kamiya (Matsumoto-city, Japan) and Haruka Kamisuki (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor unit including a semiconductor chip, a housing for accommodating the semiconductor unit, and a target member bonded to the housing by an adhesive having a water absorption rate of 0.5% or less."...