ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,558, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Circuit board assembly with bonded conductive posts and method of manufacturing circuit board assembly" was invented by Tomomi Nonaka (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip with an electrode, an insulated circuit board including an insulating board and a circuit pattern formed thereon. The circuit pattern has the semiconductor chip on a front surface thereof. The semiconductor device further includes a plurality of conductive posts, each having a lower end bonded to at least one of the fron...