US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor module and method for manufacturing semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and method for manufacturing semiconductor module" was invented by Hayato Nakano (Kofu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a semiconductor module capable of preventing the adhesion of an epoxy resin to a terminal to which at least one of a high current and a high voltage is supplied and a method for manufacturing a semiconductor module. A semiconductor module includes: a case having an inner wall defining a casting region and a peripheral edge portion arranged outside the inner wall; an intermediate terminal ...