US Patent Issued to FINISAR SHANGHAI INCORPORATION on Aug. 18 for "On-chip structure for fiber array alignment by assisting edge coupler index-matching epoxy/oil filling" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,590, issued on Aug. 18, was assigned to FINISAR SHANGHAI INCORPORATION (China).

"On-chip structure for fiber array alignment by assisting edge coupler index-matching epoxy/oil filling" was invented by Yao Sun (Shanghai), Jianhu Wei (Shanghai), Po Dong (Shanghai), Taylor Fryett (Shanghai), Wei Si (Shanghai), Shanshan Zeng (Shanghai), Tony Shi (Shanghai), Linjie Zhou (Shanghai) and Yu Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure may comprise a system for filling undercuts with an index-matching liquid on a wafer, the system comprising a plurality of edge couplers, each comprising an undercut and a w...