US Patent Issued to FENG CHIA UNIVERSITY, DAH YOUNG VACUUM EQUIPMENT on April 14 for "Semiconductor processing equipment part and method for making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,683, issued on April 14, was assigned to FENG CHIA UNIVERSITY (Taichung, Taiwan) and DAH YOUNG VACUUM EQUIPMENT Co. LTD. (Taichung City, Taiwan).

"Semiconductor processing equipment part and method for making the same" was invented by Chang-Ho Yu (Taichung City, Taiwan), Yao-Kuang Yang (Taichuing City, Taiwan), Ping-Yen Hsieh (Taichung, Taiwan), Ying-Hung Chen (Taichung, Taiwan) and Chu-Liang Ho (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A part is adapted to be used in a semiconductor processing equipment. The part includes a substrate and a protective coating. The protective coating covers at least a part of the substrate, is...