US Patent Issued to Fair Isaac on Sept. 8 for "Composable modular platform" (American, Canadian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,789, issued on Sept. 8, was assigned to Fair Isaac Corp. (Minneapolis).

"Composable modular platform" was invented by Christopher Schultz (Eagan, Minn.), Jeffrey B. Smith (Newmarket, Canada), Karissa Kay Kohn (North Saint Paul, Minn.) and Prashant Jamkhedkar (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for managing assets in a modular platform, the method comprising maintaining a plurality of declarative protocols to standardize interaction semantics between a plurality of assets in a protocol repository, wherein each declarative protocol specifies interaction rules for at least one specific asset, and each declarative pr...