ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,994, issued on Jan. 27, was assigned to EV Thermal Flow Solutions LLC (Southfield, Mich.).
"Thermal management module" was invented by Philip John Gregory Dingle (Rochester, Mich.) and Mark Raymond Rimkus (Chicago).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal management module includes a first compartment including one or more of a coolant pump, a coolant valve, and a coolant conduit. A conjoined second compartment includes one or more of a valve actuator, an electronic control module, a system pressure sensor, a temperature sensor, and a heat exchanger. In certain embodiments, the first compartment is enclosed in a first modular enclosur...