US Patent Issued to ESSENCORE on May 19 for "Heat sink for memory modules" (South Korean Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. D1,126,931, issued on May 19, was assigned to ESSENCORE Ltd. (Wanchai, Hong Kong).

"Heat sink for memory modules" was invented by Young Suk Chung (Yongin-si, South Korea).

The patent was filed on May 29, 2024, under Application No. D/944,667.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1126931&OS=D1126931&RS=D1126931

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