US Patent Issued to Enpulse on Jan. 13 for "Polishing pad and preparing method of semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,839, issued on Jan. 13, was assigned to Enpulse Co. Ltd. (Chungcheongnam-do, South Korea).

"Polishing pad and preparing method of semiconductor device using the same" was invented by Jang Won Seo (Seoul, South Korea), Eun Sun Joeng (Gyeonggi-do, South Korea), Sung Hoon Yun (Seoul, South Korea) and Jong Wook Yun (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental fri...