US Patent Issued to ENPULSE on Feb. 24 for "Polishing pad and preparing method of semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,758, issued on Feb. 24, was assigned to ENPULSE Co. LTD. (Chungcheongnam-do, South Korea).

"Polishing pad and preparing method of semiconductor device using the same" was invented by Jang Won Seo (Seoul, South Korea), Sung Hoon Yun (Seoul, South Korea), Eun Sun Joeng (Gyeonggi-do, South Korea) and Jae In Ahn (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental ...