ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,562, issued on Aug. 11, was assigned to Ennostar Corp. (Hsinchu City, Taiwan).
"Micro light-emitting package" was invented by Hsin-Lun Su (Hsinchu, Taiwan), Jo-Hsiang Chen (Hsinchu, Taiwan) and Chun-Min Lin (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin w...