US Patent Issued to ENKRIS SEMICONDUCTOR on Sept. 22 for "Semiconductor structures and manufacturing methods thereof" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,499, issued on Sept. 22, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China).

"Semiconductor structures and manufacturing methods thereof" was invented by Kai Cheng (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. The method includes: providing a patterned substrate, where the patterned substrate includes columnar structures; providing second inhibition layers, where the second inhibition layers are respectively located between two adjacent columnar structures of the columnar structures, and upper surfaces of the columnar structures are exposed; providing ...