US Patent Issued to ENKRIS SEMICONDUCTOR on July 7 for "Semiconductor structure and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,448, issued on July 7, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China).

"Semiconductor structure and preparation method thereof" was invented by Peng Xiang (Suzhou, China) and Kai Cheng (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a semiconductor structure and a preparation method thereof. The semiconductor structure includes a substrate, including a first region arranged at the center of the substrate and a second region arranged at the periphery of the first region; and a composite buffer layer arranged on the substrate, including a carbon-containing first buffer layer including at least one set of a first s...