US Patent Issued to ENKRIS SEMICONDUCTOR on April 14 for "Semiconductor structure and manufacture method therefor" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,562, issued on April 14, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China).

"Semiconductor structure and manufacture method therefor" was invented by Kai Cheng (Suzhou, China) and Weihua Liu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure and a method for manufacturing the semiconductor structure. The semiconductor structure includes an N-type semiconductor layer provided on a substrate in a vertical direction, and at least one of multiple-quantum-well structure is formed on the N-type semiconductor layer in a horizontal direction, a P-type semiconductor layer is provid...