US Patent Issued to ENJET on Sept. 8 for "3D surface printing apparatus for the edge area of substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,648, issued on Sept. 8, was assigned to ENJET Co. LTD. (Suwon-si, South Korea).

"3D surface printing apparatus for the edge area of substrate" was invented by Do Young Byun (Seoul, South Korea), Baek Hoon Seong (Hwaseong-si, South Korea) and Won-Il Son (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a 3D surface printing apparatus for the edge area of substrate, the apparatus including a jig part that erects the substrate and immobilizes it, a nozzle part that comprises a nozzle that ejects ink through Electrohydrodynamic (EHD) jetting by applying a voltage to an electrode, from above the erecte...