US Patent Issued to Eliyan on Sept. 1 for "Efficient clocking scheme for die-to-die connectivity" (California, Oregon Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,208, issued on Sept. 1, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Efficient clocking scheme for die-to-die connectivity" was invented by Ramin Farjadrad (Los Altos, Calif.) and Nhan Nguyen (Lake Oswego, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) chip includes a first data receiver including first receiver circuitry to receive first data from a second IC chip. A second data receiver includes second receiver circuitry to receive second data from the second IC chip. Timing circuitry couples to the first receiver and the second receiver in a shared configuration. The timing circuitry generates a receive tim...