US Patent Issued to Eliyan on June 9 for "Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry" (California, Washington Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,936, issued on June 9, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry" was invented by Curtis McAllister (Los Altos, Calif.), Paul Hylander (Bellevue, Wash.), Ramin Farjadrad (Los Altos, Calif.) and Syrus Ziai (Los ALtos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory chiplet includes storage and multiple memory control circuits. Each of the multiple memory control circuits to control a memory access operation to the storage. Multiple channel circuits are employed in the memory chiplet to transfer channel data between the m...