US Patent Issued to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE on June 30 for "Package for silicon photonics device and implementation method thereof" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,414, issued on June 30, was assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (Daejeon, South Korea).

"Package for silicon photonics device and implementation method thereof" was invented by Jyung Chan Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for a silicon photonics device and an implementation method thereof are disclosed. The package for a silicon photonics device according to one embodiment includes a step difference control part having an upper surface, where a silicon photonics device platform having a silicon photonics device mounted thereon is mounted, and configured to control a step ...