US Patent Issued to EBARA on Sept. 8 for "Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,497, issued on Sept. 8, was assigned to EBARA Corp. (Tokyo).

"Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus" was invented by Kazuhiro Tajima (Tokyo), Makoto Kashiwagi (Tokyo) and Manato Furusawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is reliably suctioned regardless of a flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes a porous member 334 including a substrate suction surface 334a for suctioning a substrate WF and a pressure reducer 334b communicating with pressure reducing means, a shielding member 332 including a first shieldin...