US Patent Issued to EBARA on Sept. 22 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,586, issued on Sept. 22, was assigned to EBARA Corp. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Itsuki Kobata (Tokyo) and Yosuke Himori (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the ine...