US Patent Issued to EBARA on Sept. 22 for "Polishing pad, polishing apparatus, and polishing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,354, issued on Sept. 22, was assigned to EBARA Corp. (Tokyo).

"Polishing pad, polishing apparatus, and polishing method" was invented by Keisuke Namiki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing pad and a polishing apparatus for use in polishing of a substrate, such as a wafer. Further, the present invention relates to a method of polishing a substrate, such as a wafer. At least a part of the polishing pad (30) is made of a light transmissive material (34) and a light reactive material (35). The light reactive material (35) is mixed into the light transmissive material (34)."

The patent was f...