US Patent Issued to EBARA on Oct. 20 for "Polishing apparatus and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,663, issued on Oct. 20, was assigned to EBARA Corp. (Tokyo).

"Polishing apparatus and polishing method" was invented by Yuta Suzuki (Tokyo) and Taro Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current val...