US Patent Issued to EBARA on Dec. 2 for "Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,516, issued on Dec. 2, was assigned to EBARA Corp. (Tokyo).

"Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus" was invented by Tomoatsu Ishibashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, with improved performance and throughput. The substrate cleaning apparatus includes: a cleaning tool configured to ...