US Patent Issued to EBARA on Aug. 11 for "Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,058, issued on Aug. 11, was assigned to EBARA Corp. (Tokyo).

"Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method" was invented by Toshifumi Kimba (Tokyo), Kohei Ohshima (Tokyo) and Kohei Ota (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a p...