US Patent Issued to EBARA, IS ENGINEERING on Feb. 24 for "Tape sticking system, tape sticking method, tape peeling system, and tape peeling method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,007, issued on Feb. 24, was assigned to EBARA Corp. (Tokyo) and IS ENGINEERING Co. LTD. (Niigata, Japan).

"Tape sticking system, tape sticking method, tape peeling system, and tape peeling method" was invented by Kenya Ito (Tokyo), Takumi Yamada (Tokyo), Mahito Shibuya (Niigata, Japan) and Daisuke Nagumo (Niigata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second ro...