US Patent Issued to E Ink Holdings on Aug. 25 for "Light-emitting diode package structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,938, issued on Aug. 25, was assigned to E Ink Holdings Inc. (Hsinchu, Taiwan).

"Light-emitting diode package structure and manufacturing method thereof" was invented by Sheng-Chieh Tai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode package structure includes a driving substrate, at least one light-emitting unit, and a reflective colloid. The driving substrate has a surface. The light-emitting unit includes at least one mini light-emitting diode and at least one wavelength conversion layer. The mini light-emitting diode is disposed on the surface of the driving substrate and electrically connected to the drivin...