ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,093, issued on Feb. 24, was assigned to DYNEX SEMICONDUCTOR Ltd. (Lincoln, Great Britain) and ZHUZHOU CRRC TIMES SEMICONDUCTOR Co. LTD (Zhuzhou, China).
"Semiconductor device" was invented by Robin Adam Simpson (Lincoln, Great Britain) and Yangang Wang (Lincoln, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device 1, comprising: a housing comprising a housing electrode 4; and at least one semiconductor chip 20 arranged within the housing; wherein the housing electrode 4 comprises a deformable portion 15, and the deformable portion 15 is configured to deform when a pressure difference between an interi...