US Patent Issued to DUPONT ELECTRONIC MATERIALS INTERNATIONAL, ROHM AND HAAS ELECTRONIC MATERIALS KK on June 16 for "Metallization method" (Japanese, American Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,656,680, issued on June 16, was assigned to DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC (Marlborough, Mass.) and ROHM AND HAAS ELECTRONIC MATERIALS KK (Tokyo).

"Metallization method" was invented by Mitsuru Haga (Niigata, Japan), Cong Liu (Shrewsbury, Mass.) and James F. Cameron (Brookline, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a metallization method, comprising (a) providing a photoresist layer on a first surface of a substrate, wherein the photoresist layer is formed from a photoresist composition comprising: a polymer comprising acid-labile groups; a photoacid generator; an organic phosphonic acid; and a solvent; ...