US Patent Issued to DuPont Electronic Materials Holding on June 16 for "Functionalized carbon particle CMP slurry" (Delaware Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,322, issued on June 16, was assigned to DuPont Electronic Materials Holding Inc. (Newark, Del.).

"Functionalized carbon particle CMP slurry" was invented by Arthur W. Martin (Hockessin, Del.) and Yi Guo (Newark, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates. The polishing solution includes a solvent and functionalized carbon-based particles having oxygen-containing functional groups. The functionalized carbon-based particles having oxygen-containing functional groups react with a peroxy moiety to increase oxygen to carbon atomic ratio on the ...