US Patent Issued to DOWA METALTECH on April 21 for "Insulating substrate and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,816, issued on April 21, was assigned to DOWA METALTECH Co. LTD. (Tokyo).

"Insulating substrate and manufacturing method thereof" was invented by Seiya Yuki (Nagano, Japan), Takashi Ideno (Nagano, Japan), Junichi Kinoshita (Mie, Japan) and Yukihiro Kitamura (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is brazed to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, in which a Ni plating layer that covers the brazing material layer exposed between the ceramic substrate and the heat-dissipation-si...