US Patent Issued to DOW TORAY on May 26 for "Curable hot-melt silicone composition, cured product thereof, and laminate including curable hot-melt silicone composition or cured product thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,568, issued on May 26, was assigned to DOW TORAY Co. LTD. (Tokyo).

"Curable hot-melt silicone composition, cured product thereof, and laminate including curable hot-melt silicone composition or cured product thereof" was invented by Ryosuke Yamazaki (Ichihara, Japan), Shinichi Yamamoto (Ichihara, Japan), Kouichi Ozaki (Ichihara, Japan) and Toru Imaizumi (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a hot-melt curable silicone composition that forms a cured product that can be cured at a temperature of 100deg C. or lower, has excellent storage stability, is relatively hard from curing, and has low surface tack, and a shee...