US Patent Issued to DOW TORAY on May 19 for "Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,753, issued on May 19, was assigned to DOW TORAY Co. LTD. (Tokyo).

"Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof" was invented by Maki Itoh (Ichihara, Japan), Akihiro Nakamura (Ichihara, Japan), Masahiro Saito (Ichihara, Japan) and Michitaka Suto (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having excellent curing properties, a wide range of designable viscoelastic properties such as storage elastic modulus (G') and the like, and practically sufficient pressure-sensitive adhesive s...