US Patent Issued to Dow Global Technologies on June 23 for "Barrier laminates including ethylene copolymer extruded web layers" (Singaporean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,876, issued on June 23, was assigned to Dow Global Technologies LLC (Midland, Mich.).

"Barrier laminates including ethylene copolymer extruded web layers" was invented by Edward L. Lee (Singapore), Hwee Tatz Thai (Singapore), Wu Aik Yee (Singapore) and Hwee Lun Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are laminates including polyethylene and an extruded web layer. The laminates can be adhesiveless and fully compatible with polyethylene recycling streams. They can exhibit improved, maintained, or desirable properties in comparison to existing laminate structures that are not fully compatible with polyethylene recycling s...