US Patent Issued to Dow Global Technologies, Performance Materials NA on March 17 for "Adhesiveless thermally laminated barrier heat sealing films including polyethylene" (Singaporean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,621, issued on March 17, was assigned to Dow Global Technologies LLC (Midland, Mich.) and Performance Materials NA Inc. (Midland, Mich.).

"Adhesiveless thermally laminated barrier heat sealing films including polyethylene" was invented by Edward L. Lee (Singapore), Hwee Tatz Thai (Singapore), Wu Aik Yee (Singapore) and Hwee Lun Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are heat sealing, barrier laminates including polyethylene. The laminates can be adhesiveless and fully compatible with polyethylene recycling streams. They can exhibit improved, maintained, or desirable properties in comparison to existing laminate struc...